Reflow oven - 企業ランキング(全17社)

更新日：Dec 03, 2025 集計期間:Nov 05, 2025〜Dec 02, 2025
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会社名	企業情報	代表製品
会社名	企業情報	製品画像・製品名・価格帯	概要	用途/実績例
日精本社	所在地 Tokyo/ 従業員数 300 事業内容 We offer a wide range of business solutions that satisfy the diverse needs of our customers through our trading company and manufacturing bu... 主要取引先	Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S Other	【Specifications (Excerpt)】 ■Device Size (WxDxH): 260mm x 420mm x 220mm ■Device Weight: Approximately 10kg ■Effective Object Size (WxDxH)...	【Applications】 ■ Solder reflow assembly without using flux ■ Functional materials development field (battery electrodes, conductive film mat...
		Formic Acid and Hydrogen Reduction Compatible Vacuum Solder Reflow Device RSS-210-S Other	【Specifications (Excerpt)】 ■Device Size (WxDxH): 430x295x290mm ■Device Weight: Approximately 22kg ■Effective Object Size (WxDxH): 200mmx...	【Applications】 ■ Solder reflow mounting without using flux ■ Functional materials development field (battery electrodes, conductive film mat...
		Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S Other	【Specifications (Excerpt)】 ■Device Size (WxDxH): 300x420x220mm ■Device Weight: Approximately 12kg ■Effective Object Size (WxDxH): 155mmx...	【Applications】 ■ Solder reflow assembly without using flux ■ Functional materials development field (battery electrodes, conductive film mat...
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日精本社

所在地

Tokyo/

従業員数

300

事業内容

We offer a wide range of business solutions that satisfy the diverse needs of our customers through our trading company and manufacturing bu...

主要取引先

代表製品

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S

概要

【Specifications (Excerpt)】 ■Device Size (WxDxH): 260mm x 420mm x 220mm ■Device Weight: Approximately 10kg ■Effective Object Size (WxDxH)...

用途/実績例

【Applications】 ■ Solder reflow assembly without using flux ■ Functional materials development field (battery electrodes, conductive film mat...

Formic Acid and Hydrogen Reduction Compatible Vacuum Solder Reflow Device RSS-210-S

概要

【Specifications (Excerpt)】 ■Device Size (WxDxH): 430x295x290mm ■Device Weight: Approximately 22kg ■Effective Object Size (WxDxH): 200mmx...

用途/実績例

【Applications】 ■ Solder reflow mounting without using flux ■ Functional materials development field (battery electrodes, conductive film mat...

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S

概要

【Specifications (Excerpt)】 ■Device Size (WxDxH): 300x420x220mm ■Device Weight: Approximately 12kg ■Effective Object Size (WxDxH): 155mmx...

用途/実績例

【Applications】 ■ Solder reflow assembly without using flux ■ Functional materials development field (battery electrodes, conductive film mat...
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所在地

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事業内容

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Reflow oven - 企業ランキング(全17社)

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